Versaflow 3/66
Modularity for highly flexible selective soldering of XL assemblies
In order to meet all requirements in terms of flexibility, the third generation VERSAFLOW has been created as a modular platform. The VERSAFLOW 3/66 belongs to this generation of machines and is especially designed for the selective soldering of PCBs in “XL” format. PCBs with dimensions of up to 610 mm x 610 mm pose no problem for this modern soldering system.
Doubling the throughput rate, maximum flexibility
Both preheating and solder modules with single wave pots can be additionally equipped with top-side heating systems. Thanks to the dual-track option, the throughput rate can be doubled without increasing the footprint of the machine. If the size of the assembly also allows segmentation of the preheating modules, a further increase in throughput is possible. These options enable the VERSAFLOW 3/66 to achieve extremely short amortization periods and offer the highest throughput rates currently available in the market of selective soldering systems, coupled with maximum flexibility in electronics assembly manufacturing
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- High-end selective soldering system to integrate into in-line manufacturing concepts
- Maximum PCB size: 610 x 610 mm (24″ x 24″)
- Parallel process through separation of fluxing, preheating and soldering
- Use of up to 4 flux spray heads
- Flexible system configuration due to modular machine design
- Ideal for linking to manual workstations or peripheral equipment
- Secure process control with monitoring of all relevant parameters
- CAD Assistant for offline programming
- Link for traceability systems for process contro
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