Shielding electronic function from external influences ensures long product life cycles for harsh marine, automotive, medical and consumer electronics applications

Process flexibility and superior performance underscore Henkel’s complete portfolio of die attach pastes for lead frame devices

Liquid encapsulants deliver protection from moisture, water and solder overflow during thermal processing, while reinforcing mechanical strength.

Enables a simple, fast bond for high-speed manufacturing

Single component formulations provide solvent-free adhesion while still curing in seconds when exposed to light.

Surface Mount Adhesives are used to hold components in place during component placement and soldering.

To address the thermal demands of today’s electronic devices, Henkel has developed a complete portfolio of high-performance, user-friendly products.

Full or partial underfill solutions with fast cure, room temperature flowability, high reliability, reworkability, and excellent SIR performance

Protection in extreme environments

Gasketing sealant solutions to ensure intact and leak-free seals and resistance to high temperatures, pressure, and vibrations

Instant adhesives made for a fast and reliable bond

Retaining Compounds are adhesives used to secure bearings, bushings, gears and cylindrical parts onto housings or shafts.

Long-term, reliable electrical function begins with solder joint integrity

Formulated to provide tough, durable bonds to a wide variety of surfaces

Eliminate fastener loosening because failure is not an option.

Thread sealants prevent fluid leaks on metal pipes and joints