Underfills
Our innovative capillary flow, edge, and corner bond underfills for CSP, BGA, WLCSP, LGA and other similar devices lower stress, improve reliability, and offers outstanding results.
Underfill is used in the manufacture of a large number of electronic parts. It helps to stabilize and reinforce solder joints and raise the thermal cycle performance of otherwise delicate components.
Underfills are being increasingly used to manufacture portable devices due to:
- Finer pitch packages
- POP packages
- More compact PCBs
- Challenging drop test requirements
- Larger BGA, CSPs, and WLCSPs
These issues have come about because of the growing demand for lighter, smaller devices, and improved reliability. Adding underfill to these products helps to enhance the performance of these precision pieces and allows manufactures to maintain a high level of quality.
Types of Underfill subset:
- Underfill CSP – The use of chip scale packages (CSPs) has expanded rapidly in recent years. CSPs are most commonly used in electronic assembly. Underfills are often used to help increase the mechanical strength of the CSP-to-board connection and to ensure CSPs meet mechanical shock and bending requirements.
- Underfill BGA – Many manufacturers use underfill BGA packaging in order to strengthen solder joints and reinforce a product’s resistance to vibration and thermal shock.
- Underfill WLCSP – Underfills can significantly improve the dropping performance and raise the thermal cycle performance of Wafer Level Chip Scale Packages (WLCSPs). This helps to extend the lifespan of WLCSPs.
- Underfill LGA – Land Grid Array (LGA) devices can also benefit from underfills. Underfills are used to enhance LGA mechanical strength and reliability.
- Partial underfill – Corner or edge bond underfills are more thixotropic than standard capillary flow solutions and dispensed or jetted on the outer sections of a package resulting in enhanced reinforcement. Henkel offers material solutions not only in full capillary flow, but also semi-reinforcement solutions such as edge and corner bond adhesives.
-
Henkel’s LOCTITE® ECCOBOND and LOCTITE® underfills offer the highest levels of reliability with the options of both reworkable and non-reworkable formulations. Materials are available that deliver ultimate processability with fast flow speeds and the capability to effectively fill bottom-side component spaces with extremely low bump heights. Formulations are designed to reduce stress caused by mismatched expansion coefficients and have outstanding reliability in thermal cycling, thermal shock, drop testing, and other demanding tests, as well as in use.
To enhance the reliability of many handheld devices, Henkel’s LOCTITE® portfolio of underfills offers formulations that quickly fill the space between the package and board, cure fast, offer outstanding protection for solder joints against mechanical strains such as shock, drop and vibration, and allow for reworkability. For applications where full underfill is not required, LOCTITE® cornerbond and edgebond technologies provide a cost-effective solution, with strong perimeter reinforcement and self-centering capability.
-
