Hot Melt Adhesives
Low Pressure Molding
Protect electronics in three simple steps with sustainable, cost-effective TECHNOMELT® materials.
How does low pressure molding with TECHNOMELT® and LOCTITE® materials work? It’s really simple, because you are able to encapsulate your electronic products in only three steps:
- Insert bare electronics into your predesigned mold set
- Henkel encapsulates electronics at low pressure and temperatures
- Test parts and move them to final assembly — immediately after molding
It is similar to plastic injection molding but operating at a lower pressure, which makes this manufacturing method perfect for electronic components. Compared to Potting, low pressure molding reduces manufacturing times significantly and less cleaning requirements are needed.
Low Pressure Molding Materials
Henkel low pressure molding materials are specially designed for PCB protection while helping you cut cost and improve quality across different applications. Our low pressure molding compounds include thermoplastic polyamides and polyolefin hot melt adhesives suitable for different low pressure molding systems. Low pressure molding is a faster and more efficient process than conventional potting. Henkel is a one-part material that requires no mixing or curing and, therefore, reduces material consumption through streamlined, multi-level, and contour-exact encapsulation.
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Electronic components need to be protected against moisture, chemical exposure and high temperatures, but standard production cycles with bonding and encapsulation takes time and have design limitation.
TECHNOMELT® and LOCTITE® low pressure molding material solutions from Henkel offer streamlined processing and excellent protection for Medical, Electronic Components, Power & Industrial Automation, HVAC and Lighting applications.LOCTITE® low pressure molding materials have been tested to Henkel’s protocols based upon ISO-10993 biocompatibility standards, with certificates available on request. The simplicity of these products is their advantage: the entire Henkel operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. For these reasons, TECHNOMELT® and LOCTITE® are increasingly being chosen as an alternatives to encapsulating processes (e.g. potting) as well as conventional plastic housings.
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