Conductive Die Attach Pastes
Henkel electrically conductive die attach pastes for leadframe and laminate wirebond packages satisfy numerous application-specific processing and performance requirements. Whether prioritizing small die-to-pad ratios, thin bondlines, high temperature capability or all of the above, Henkel’s portfolio has a broad selection of proven materials that ensure operational and device functionality objectives are met.
A broad selection of electrically conductive LOCTITE® ABLESTIK® conductive die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to Smart Cards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel conductive die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as Bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.
Non-Conductive Die Attach Pastes
Henkel non-conductive die attach pastes are designed to deliver strong adhesion within both laminate and leadframe wirebond packages. Robust die stacking, thin bondlines, low warpage, high temperature compatibility, and low stress are a few of the many material capabilities of Henkel’s line of non-conductive die attach pastes. Ensuring package integrity, while adhering to stringent JEDEC MSL1 standards, non-conductive die attach pastes deliver the reliability required for next generation wirebond package designs.
Printable Board-On-Chip Die Attach Materials
As board-on-chip (BOC) – also known as substrate-on-chip – packaging emerges as the dominant chip-scale packaging configuration for DRAM devices, die attach materials must deliver with precise control of bondline thickness and die tilt, minimal fillet formation and no contamination of wire bond pads. Henkel’s B-stage printable adhesives offer a more cost-effective solution than conventional adhesive films, providing the robust performance of film at a paste price point. The portfolio of LOCTITE® ABLESTIK® materials for BOC applications offers high UPH, printable formulations with low flow, controlled bondlines, minimized tolerance and bleed, as well as long storage and work lives.
Full-Sintering Die Attach paste
The increasing request of electrical/hybrid vehicle and 5G communication drives the need of the solutions providing better thermal dissipation, reliability, and thermal stability (bond joint temperatures can be up to 175°C with 50-100°C delta in a few seconds or a few minutes). Pure silver sintering die attach paste has attracted attention because AG has the best electrical conductivity, the second-best thermal conductivity, and the high thermal stability. The pure metallic bond formed at interface also provided much better reliability than solder.
Henkel full silver sintering material SSP2020 can support both pressureless and pressure assistant sintering according to customer needs. It provides >200W/mk thermal conductivity, proved reliability, and excellent workability even under pressure less condition. We also offer full-sintering silver die attach paste for increased conductive performance in electronic applications.
Semi-Sintering Die Attach Paste
Smaller, higher functioning devices within applications in various market sectors are increasing power densities and driving the need for more effective heat dissipation. While thermal interface materials offer this capability at the board and component level, more user-friendly and effective thermal management solutions are needed at the die level.
Henkel’s new series of high thermal semi-sintering die attach pastes enable robust package-level sintering and overcome the regulatory challenges of solder, thermal conductivity limitations of traditional die attach materials, and processability complexities of pure sintering pastes. The LOCTITE® ABLESTIK® ABP 8068T portfolio are high thermal, semi-sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high-power density devices.
