Board-Level Encapsulants

Dam and Fill Encapsulation

Henkel’s dam and fill solutions provide a number of product and application method options for manufactures. There are three parts of encapsulation compound systems which includes a polymer, hardener, and filler. For PCB encapsulation, a number of different dispensing processes can be used based on the manufacturer’s equipment. This includes time/pressure, auger, and positive displacement dispensing methods. 

The dam and fill encapsulation method has been utilized across a number of manufacturing processes. A dam is a thin border that is dispensed around the application area according to a preset size specification. The fill then is dispensed within the confines of the dam area in which it encapsulants and protects the die wires underneath. There are different encapsulant chemistries to choose from based on your specific needs. For this reason, the ECCOBOND^® line offers a number of materials for both the dam and fill processes. From heat curing and UV cure encapsulant options to epoxy and acrylic chemistries, our product portfolio has a variety of product solutions for board-level encapsulation.

Glob Topping

Glob top materials that excellent temperature stability, good thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage during cure, low stress, and excellent chemical resistance. They are developed to provide protection to wire bonds and leads across a comprehensive range of electronic applications, bringing superior reliability, stability, and electrical insulation in high stress environments and across a range of temperatures. The absence of a dam reduces cost and increases efficiency for operations that utilize glob topping.

Henkel’s line of LOCTITE^® ECCOBOND^® glob top encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. Our glob top materials are designed to meet the demanding requirements of manufacturers in many industries—ensuring easy application, strong bonding, and fast curing times for a variety of electrical components. Henkel has designed its glob top epoxies, adhesives, and other materials to fit seamlessly within your existing cycles, offering ultimate versatility in a comprehensive range of industrial processes. 

Henkel high-purity glob top encapsulants deliver unmatched performance for a variety of products including transistors, system in package (SIP) devices, ASICs, and chip-on-board applications. Cycle time and costs can be reduced through the use of LOCTITE^® ECCOBOND^® glob top materials, bringing increased efficiency to a range of processes. These materials for chip-on-board applications are designed to cure quickly to fit easily within high-speed manufacturing operations. 

Like all Henkel materials, ECCOBOND^® glob top encapsulants are formulated and tested in-process and in the context of full-package assembly. They meet the most stringent JEDEC-level testing requirements and are developed to deliver outstanding performance within high temperature, lead-free environments. Partner with Henkel and discover the very best chip-on-board materials designed for the next generation of electrical devices.

Glob Top Chemistries

Each of the glob top materials in our ECCOBOND^® range is also designed to meet strict environmental compliance, allowing manufacturers to reduce harsh chemicals during manufacturing processes and increase sustainability. Available as thermal, ultraviolet (UV), or moisture cure materials, Henkel has developed a suitable glob top encapsulant for your specific requirements. Additionally, halogen-free encapsulants ensure safer processing during assembly.

The ECCOBOND^® range glob top encapsulant chemistries:

• Epoxy
• Silicone
• Acrylates