Optical Inspection Systems

Ersascope M plus XL

Inspection systems for the quick inspection of hidden solder joints on large circuit boards

Versatile. Designed for optical inspection and digital imaging – including measurement of solder joints on BGAs and other SMT components. The area of application includes the visual inspection of components on printed circuit boards in SMT or THT in general, but also the visual inspection of LP surfaces or solder paste prints.

Introduction

- Inspection systems with two quick change lenses:
  – 90° BGA optics (approx. 280 µm clearance)
  – 0° MACROZOOM top view optics
- Fast, stationary inspection of hidden solder joints
- Integrated, dimmable LED lighting or external LED light source with goose neck fibre light and light brush
- 5 Megapixel N-MOS colour camera with USB connection
- XY table in XL version with fine adjust wheels, freely positionable under the optics
- Optics extraction unit for the inspection of front components on particularly deep PCBs
- Ideal for stationary inspection of large asseblies
- Including Ersa ImageDoc v3 inspection software (basic version)