Optical Inspection Systems

Ersascope M + M plus

Inspection systems for quick inspection of hidden solder joints

Versatile. Designed for optical inspection and digital imaging – including measurement of solder joints on BGAs and other SMT components. The area of ​​application includes the visual inspection of components on printed circuit boards in SMT or THT in general, but also the visual inspection of LP surfaces or solder paste prints.


    • Inspection systems with two quick change lenses:
      – 90° BGA optics (approx. 280 µm clearance)
      – 0° MACROZOOM top view optics
    • Fast, stationary inspection of hidden solder joints
    • Integrated, dimmable LED lighting or external LED light source with goose neck fibre light and light brush
    • 5 Megapixel N-MOS colour camera with USB connection
    • Ideal for stationary inspection
    • Including Ersa ImageDoc v3 inspection software (basic version)

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