The SRO-700 vacuum soldering system is for semiconductor and MEMS applications, offering 97 mm clearance over the heated surface. It can be used for vacuum soldering processes for low volume production or R&D. The cold wall chamber principle supports effective thermal management, while the IR heating technology provides consistent heat distribution. Using vacuum and formic acid, the SRO-700 ensures void-free solder joints and delivers consistent, reliable results every time.

The SRO-716 is the most versatile vacuum soldering system which offers precision and reliability for a wide range of process requirements. As a central element in many R&D centers and pilot productions, it guarantees excellent results in the areas of vacuum soldering and brazing. The process chamber is heated by powerful infrared emitters up to a maximum temperature of 450 °C (optionally up to 750°C). Adjustable heating zones ensure a homogeneous temperature distribution. Formic acid creates clean, oxide-free surfaces and promotes superior solder wetting for perfect joint quality. With a heated area of 314 × 314 mm and 95 mm clearance, the SRO-716 is compatible with a wide range of electronic components and packages. Optional features such as high vacuum, overpressure, top heating, flux management for solder paste and H2/N2H2 compatibility provide maximum flexibility for various applications.

The SRO i-LINE sets new standards in series production and combines maximum efficiency with excellent process control. Thanks to its compact design and the option of integrating up to three process chambers, the SRO i-LINE maximizes production capacity without requiring additional space. Short cycle times and advanced vacuum soldering technology ensure perfect results for applications in the microelectronics and semiconductor industries. The powerful IR heating technology ensures excellent temperature homogeneity across the entire work surface, while the integrated formic acid system guarantees optimum wetting and ensures pore-free solder joints. By evacuating to <1 mbar and filling the process chamber with ultra-pure N2 gas, an oxygen content of less than 3 ppm can be achieved. The SRO i-LINE enables both heating via heating plates and direct component heating. This allows even complex component geometries, such as products with integrated cooling channels, to be processed reliably. Maintenance has also been optimized to avoid production downtime: while one chamber is being serviced, production continues on two chambers. Whether used independently or as a fully integrated solution in an automated production line with high throughput, low scrap rates, and maximum process reliability, the SRO i-LINE offers a real advantage.

High-temperature furnace for annealing, oxidation, polyimide application. The PEO-604 quartz tube furnace offers outstanding performance and versatility for demanding thermal applications. It is perfectly suited for research, pilot production and high volume production. Processes up to 50 wafers per run with a maximum wafer diameter of 200 mm are feasible. The high temperature furnace guarantees contamination free processing thanks to the easily exchangeable quartz liners, which prevent process to process cross-contamination.