Dynamic z-axis and sequential soldering 2.0
In the electronics production of the future, more and more power electronic and digital components will be combined on the same product. It is therefore necessary to be able to adjust the distance between nozzles and circuit boards individually for each product and to specify different distances within a product. The POWERFLOW FIVE features a new dynamic z-axis control for sequential soldering 2.0 – this new z-axis allows distances between the waveform generator and flat assembly of 5 to 18 mm. The second waveform generator is also independently adjustable in height. All settings can be conveniently adjusted via the operating software. The independent nozzle adjustment dynamically adapts to different requirements. With an accuracy of 0.1 mm and 10 individually controllable sections, sequential soldering 2.0 guarantees perfect solder joints for even the most complex mixed-technology assemblies.
SMART WAVE GUARD wave height control and adjustment
The soldering module enables 1.5 mio. maintenance-free strokes, guaranteeing maximum availability. To keep the wave height constant, the POWERFLOW FIVE features new measurement technology that checks the solder wave height at regular intervals and automatically adjusts the solder overflow if necessary. This ensures uniform wetting and constant pressure at the nozzle outlet.
