{"id":6123,"date":"2026-06-03T07:04:48","date_gmt":"2026-06-03T07:04:48","guid":{"rendered":"http:\/\/longshinegroup.com\/?page_id=6123"},"modified":"2026-06-03T07:21:43","modified_gmt":"2026-06-03T07:21:43","slug":"kurtz-ersa-semicon","status":"publish","type":"page","link":"https:\/\/longshinegroup.com\/?page_id=6123","title":{"rendered":"Ersa SEMICON"},"content":{"rendered":"<div>Ersa SEMICON<br \/>Competence in Microelectronics &amp; Semiconductor Technology<\/div>\n<ul>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/05\/SRO-700.png\" alt=\"\"><\/p>\n<h3>SRO &#8211; 700<\/h3>\n<div>\n<p><span>The SRO-700 vacuum soldering system is for semiconductor and MEMS applications, offering 97 mm clearance over the heated surface. It can be used for vacuum soldering processes for low volume production or R&amp;D. The cold wall chamber principle supports effective thermal management, while the IR heating technology provides consistent heat distribution. Using vacuum and formic acid, the SRO-700 ensures void-free solder joints and delivers consistent, reliable results every time.<\/span><\/p>\n<header>\n<h5>Technical Highlights <span class=\"overline\">SRO-700<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Formic acid enriched atmosphere<\/li>\n<li>Direct IR heating<\/li>\n<li>Multiple TC monitoring<\/li>\n<li>Process temperature up to 450 \u00b0C<\/li>\n<li>Oxygen &lt;3.0 ppm with purified N<sub>2<\/sub><\/li>\n<\/ul>\n<header>\n<h5>Common Applications <span class=\"overline\">SRO-700<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Power semiconductors (IGIBT, SiC-MOSFET)<\/li>\n<li>Sensors<\/li>\n<li>MEMS devices<\/li>\n<li>Die Attachment<\/li>\n<li>High-power LED<\/li>\n<li>Hybrid assembly<\/li>\n<li>Flip Chip<\/li>\n<li>Package sealing<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/05\/SRO-GETTER.jpg\" alt=\"\"><\/p>\n<h3>SRO &#8211; GETTER<\/h3>\n<div>\n<header class=\"headline\">\n<h5>High vacuum packaging with thermal getter activation<\/h5>\n<\/header>\n<div class=\"product-intro ce-textpic\">The SRO-GETTER is designed to seal packages with lids, which incorporate getter material to maintain a high vacuum over the lifetime of MEMS devices like microbolometers and gyroscopes. It can be used for R&amp;D and in production lines. The device features top and bottom IR heating with two independently monitored and controlled heating zones. It can heat uniformly up to 450 \u00b0C. Package and lid are thermally isolated during the getter activation to keep the temperature sensitive device below 100 \u00b0C. The tooling is designed specifically to accommodate the customer package and allows optimal process control and precise package-to-lid alignment. A mass spectrometer can be added as an option to the system for residual gas analysis (RGA) during the sealing process.<\/div>\n<div>\n<header>\n<h5>Technical Highlights <span class=\"overline\">SRO-GETTER<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>High vacuum capability<\/li>\n<li>Independent temperature control of lid and package<\/li>\n<li>Process temperature up to 450 \u00b0C<\/li>\n<li>Package and lid separated during high vacuum getter activation<\/li>\n<li>Multiple TC monitoring<\/li>\n<\/ul>\n<header>\n<h5>Common Applications <span class=\"overline\">SRO-GETTER<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Package sealing with high vacuum encapsulation<\/li>\n<li>Thermal getter activation<\/li>\n<li>Microbolometers<\/li>\n<li>IR detectors<\/li>\n<li>Gyroscopes<\/li>\n<li>Sensors<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/05\/SRO716.jpg\" alt=\"\"><\/p>\n<h3>SRO &#8211; 716<\/h3>\n<div>\n<p><span>The SRO-716 is the most versatile vacuum soldering system which offers precision and reliability for a wide range of process requirements. As a central element in many R&amp;D centers and pilot productions, it guarantees excellent results in the areas of vacuum soldering and brazing. The process chamber is heated by powerful infrared emitters up to a maximum temperature of 450 \u00b0C (optionally up to 750\u00b0C). Adjustable heating zones ensure a homogeneous temperature distribution. Formic acid creates clean, oxide-free surfaces and promotes superior solder wetting for perfect joint quality. With a heated area of 314 \u00d7 314 mm and 95 mm clearance, the SRO-716 is compatible with a wide range of electronic components and packages. Optional features such as high vacuum, overpressure, top heating, flux management for solder paste and H2\/N2H2 compatibility provide maximum flexibility for various applications.<\/span><\/p>\n<header>\n<h5>Technical Highlights <span class=\"overline\">SRO-716<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Direct IR heating<\/li>\n<li>Multiple TC monitoring<\/li>\n<li>Solder paste or preform, flux-less or flux<\/li>\n<li>Exchangeable heater plate<\/li>\n<li>Process temperature up to 450 \u00b0C, optional up to 750 \u00b0C<\/li>\n<li>Oxygen &lt;3.0 ppm with purified N2<\/li>\n<\/ul>\n<header>\n<h5>Common Applications <span class=\"overline\">SRO-716<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Power semiconductor (IGIBT, SiC-MOSFET)<\/li>\n<li>Sensors<\/li>\n<li>MEMS devices<\/li>\n<li>Die Attachment<\/li>\n<li>High-power LED<\/li>\n<li>Hybrid assembly<\/li>\n<li>Flip Chip<\/li>\n<li>Package sealing<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/05\/iline.jpg\" alt=\"\"><\/p>\n<h3>SRO i &#8211; LINE<\/h3>\n<div>\n<p><span>The SRO i-LINE sets new standards in series production and combines maximum efficiency with excellent process control. Thanks to its compact design and the option of integrating up to three process chambers, the SRO i-LINE maximizes production capacity without requiring additional space. Short cycle times and advanced vacuum soldering technology ensure perfect results for applications in the microelectronics and semiconductor industries. The powerful IR heating technology ensures excellent temperature homogeneity across the entire work surface, while the integrated formic acid system guarantees optimum wetting and ensures pore-free solder joints. By evacuating to &lt;1 mbar and filling the process chamber with ultra-pure N2 gas, an oxygen content of less than 3 ppm can be achieved. The SRO i-LINE enables both heating via heating plates and direct component heating. This allows even complex component geometries, such as products with integrated cooling channels, to be processed reliably. Maintenance has also been optimized to avoid production downtime: while one chamber is being serviced, production continues on two chambers. Whether used independently or as a fully integrated solution in an automated production line with high throughput, low scrap rates, and maximum process reliability, the SRO i-LINE offers a real advantage.<\/span><\/p>\n<header>\n<h5>Technical Highlights <span class=\"overline\">SRO i-LINE<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>HHigh capacity: up to 3 process chambers<\/li>\n<li>Short cycle times<\/li>\n<li>Advanced IR technology<\/li>\n<li>Excellent temperature uniformity<\/li>\n<li>Process temperature up to 450 \u00b0C<\/li>\n<li>Oxygen &lt;3.0 ppm with purified N2<\/li>\n<li>Small footprint: no change in footprint for up to 3 process chambers<\/li>\n<li>Low maintenance downtime: two process chambers can operate while one is being serviced, minimizing downtime and ensuring\u00a0continuous production<\/li>\n<\/ul>\n<header>\n<h5>Common Applications <span class=\"overline\">SRO i-LINE<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Power semiconductors (IGIBT, SiC-MOSFET)<\/li>\n<li>Sensors<\/li>\n<li>MEMS devices<\/li>\n<li>Die Attachment<\/li>\n<li>High-power LED<\/li>\n<li>Hybrid assembly<\/li>\n<li>Flip Chip<\/li>\n<li>Package sealing<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/05\/PEO604.jpg\" alt=\"\"><\/p>\n<h3>PEO &#8211; 604<\/h3>\n<div>\n<p><span>High-temperature furnace for annealing, oxidation, polyimide application. The PEO-604 quartz tube furnace offers outstanding performance and versatility for demanding thermal applications. It is perfectly suited for research, pilot production and high volume production. Processes up to 50 wafers per run with a maximum wafer diameter of 200 mm are feasible. The high temperature furnace guarantees contamination free processing thanks to the easily exchangeable quartz liners, which prevent process to process cross-contamination.<\/span><\/p>\n<header>\n<h5>Technical Highlights <span class=\"overline\">PEO-604<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Space-saving thanks to small footprint<\/li>\n<li>Max. 50 wafers per process run<\/li>\n<li>Wafers up to \u00d8 200 mm<\/li>\n<li>No cross-contamination between different processes thanks to easily replaceable liners<\/li>\n<li>20 \u00b0C to 1,000 \u00b0C within 25 minutes (empty chamber)<\/li>\n<li>Cooling from 1,000 \u00b0C to &lt;100 \u00b0C within 60 minutes (empty chamber)<\/li>\n<li>High vacuum up to 5 x 10-6 mbar<\/li>\n<li>Oxygen &lt;3.0 ppm with ultra-pure gas N<sub>2<\/sub><\/li>\n<\/ul>\n<header>\n<h5>Common Applications <span class=\"overline\">PEO-604<\/span><\/h5>\n<\/header>\n<div class=\"product-description ce-textpic\">\n<ul>\n<li>Annealing:\n<ul>\n<li>Inert\/Atmosphere<\/li>\n<li>Hydrogen<\/li>\n<li>High vacuum<\/li>\n<\/ul>\n<\/li>\n<li>Wet\/Dry oxidation<\/li>\n<li>SiAl\/SiAu\/SiMo alloying<\/li>\n<li>Polyimide process<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/li>\n<\/ul>\n<p><!--more--><br \/>\n<!-- {\"name\":\"* LAYOUT | Product Category - Sample\",\"type\":\"layout\",\"children\":[{\"type\":\"section\",\"props\":{\"style\":\"default\",\"width\":\"xlarge\",\"vertical_align\":\"middle\",\"title_position\":\"top-left\",\"title_rotation\":\"left\",\"title_breakpoint\":\"xl\",\"image_position\":\"center-center\",\"image\":\"wp-content\\\/uploads\\\/2022\\\/02\\\/Reflow-Soldering-Systems.webp\",\"image_size\":\"cover\",\"media_overlay\":\"rgba(25, 74, 126, 0.94)\",\"text_color\":\"light\",\"padding\":\"large\",\"media_blend_mode\":\"luminosity\",\"image_effect\":\"fixed\"},\"children\":[{\"type\":\"row\",\"children\":[{\"type\":\"column\",\"props\":{\"position_sticky_breakpoint\":\"m\",\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\"},\"children\":[{\"type\":\"headline\",\"props\":{\"title_element\":\"div\",\"content\":\"Ersa SEMICON<br \\\/>Competence in Microelectronics &amp; Semiconductor Technology\",\"title_style\":\"heading-medium\",\"text_align\":\"center\",\"margin\":\"xlarge\"},\"name\":\"Category Headline\"}]}]}],\"modified\":\"2022-01-21T06:10:44.597Z\",\"name\":\"Header\"},{\"type\":\"section\",\"props\":{\"style\":\"muted\",\"width\":\"default\",\"vertical_align\":\"middle\",\"title_position\":\"top-left\",\"title_rotation\":\"left\",\"title_breakpoint\":\"xl\",\"image_position\":\"center-center\",\"image\":\"\",\"image_size\":\"cover\"},\"children\":[{\"type\":\"row\",\"children\":[{\"type\":\"column\",\"props\":{\"position_sticky_breakpoint\":\"m\",\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\"},\"children\":[{\"type\":\"switcher\",\"props\":{\"show_title\":true,\"show_meta\":true,\"show_content\":true,\"show_image\":true,\"show_link\":true,\"show_label\":true,\"show_thumbnail\":true,\"switcher_animation\":\"fade\",\"switcher_height\":true,\"nav\":\"subnav\",\"nav_position\":\"left\",\"nav_align\":\"left\",\"nav_grid_width\":\"1-2\",\"nav_grid_breakpoint\":\"m\",\"thumbnav_svg_color\":\"emphasis\",\"title_element\":\"h3\",\"title_align\":\"top\",\"title_grid_width\":\"1-2\",\"title_grid_breakpoint\":\"m\",\"meta_style\":\"meta\",\"meta_align\":\"below-title\",\"meta_element\":\"div\",\"content_column_breakpoint\":\"m\",\"image_svg_color\":\"emphasis\",\"image_align\":\"top\",\"image_grid_width\":\"1-2\",\"image_grid_breakpoint\":\"m\",\"thumbnav_width\":\"100\",\"thumbnav_height\":\"75\",\"link_text\":\"Read more\",\"link_style\":\"primary\",\"margin\":\"default\",\"nav_style_primary\":true,\"text_align\":\"left\",\"text_align_breakpoint\":\"m\",\"text_align_fallback\":\"center\",\"title_font_family\":\"secondary\",\"link_target\":true},\"children\":[{\"type\":\"switcher_item\",\"props\":{\"title\":\"SRO - 700\",\"content\":\"\n\n<p><span>The SRO-700 vacuum soldering system is for semiconductor and MEMS applications, offering 97 mm clearance over the heated surface. It can be used for vacuum soldering processes for low volume production or R&amp;D. The cold wall chamber principle supports effective thermal management, while the IR heating technology provides consistent heat distribution. Using vacuum and formic acid, the SRO-700 ensures void-free solder joints and delivers consistent, reliable results every time.<\\\/span><\\\/p>\\n\n\n<header>\\n\n\n<h5>Technical Highlights <span class=\\\"overline\\\">SRO-700<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Formic acid enriched atmosphere<\\\/li>\\n\n\n<li>Direct IR heating<\\\/li>\\n\n\n<li>Multiple TC monitoring<\\\/li>\\n\n\n<li>Process temperature up to 450 \\u00b0C<\\\/li>\\n\n\n<li>Oxygen &lt;3.0 ppm with purified N<sub>2<\\\/sub><\\\/li>\\n<\\\/ul>\\n\n\n<header>\\n\n\n<h5>Common Applications <span class=\\\"overline\\\">SRO-700<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Power semiconductors (IGIBT, SiC-MOSFET)<\\\/li>\\n\n\n<li>Sensors<\\\/li>\\n\n\n<li>MEMS devices<\\\/li>\\n\n\n<li>Die Attachment<\\\/li>\\n\n\n<li>High-power LED<\\\/li>\\n\n\n<li>Hybrid assembly<\\\/li>\\n\n\n<li>Flip Chip<\\\/li>\\n\n\n<li>Package sealing<\\\/li>\\n<\\\/ul>\\n<\\\/div>\\n<\\\/div>\\n\n\n<p><\\\/p>\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2026\\\/05\\\/SRO-700.png\",\"link\":\"\"}},{\"type\":\"switcher_item\",\"props\":{\"title\":\"SRO - GETTER\",\"content\":\"\n\n<header class=\\\"headline\\\">\\n\n\n<h5>High vacuum packaging with thermal getter activation<\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-intro ce-textpic\\\">The SRO-GETTER is designed to seal packages with lids, which incorporate getter material to maintain a high vacuum over the lifetime of MEMS devices like microbolometers and gyroscopes. It can be used for R&amp;D and in production lines. The device features top and bottom IR heating with two independently monitored and controlled heating zones. It can heat uniformly up to 450 \\u00b0C. Package and lid are thermally isolated during the getter activation to keep the temperature sensitive device below 100 \\u00b0C. The tooling is designed specifically to accommodate the customer package and allows optimal process control and precise package-to-lid alignment. A mass spectrometer can be added as an option to the system for residual gas analysis (RGA) during the sealing process.<\\\/div>\\n\n\n<div>\n\n<header>\\n\n\n<h5>Technical Highlights <span class=\\\"overline\\\">SRO-GETTER<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>High vacuum capability<\\\/li>\\n\n\n<li>Independent temperature control of lid and package<\\\/li>\\n\n\n<li>Process temperature up to 450 \\u00b0C<\\\/li>\\n\n\n<li>Package and lid separated during high vacuum getter activation<\\\/li>\\n\n\n<li>Multiple TC monitoring<\\\/li>\\n<\\\/ul>\\n\n\n<header>\\n\n\n<h5>Common Applications <span class=\\\"overline\\\">SRO-GETTER<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Package sealing with high vacuum encapsulation<\\\/li>\\n\n\n<li>Thermal getter activation<\\\/li>\\n\n\n<li>Microbolometers<\\\/li>\\n\n\n<li>IR detectors<\\\/li>\\n\n\n<li>Gyroscopes<\\\/li>\\n\n\n<li>Sensors<\\\/li>\\n<\\\/ul>\\n<\\\/div>\\n<\\\/div>\\n<\\\/div>\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2026\\\/05\\\/SRO-GETTER.jpg\",\"link\":\"\"}},{\"type\":\"switcher_item\",\"props\":{\"title\":\"SRO - 716\",\"content\":\"\n\n<p><span>The SRO-716 is the most versatile vacuum soldering system which offers precision and reliability for a wide range of process requirements. As a central element in many R&amp;D centers and pilot productions, it guarantees excellent results in the areas of vacuum soldering and brazing. The process chamber is heated by powerful infrared emitters up to a maximum temperature of 450 \\u00b0C (optionally up to 750\\u00b0C). Adjustable heating zones ensure a homogeneous temperature distribution. Formic acid creates clean, oxide-free surfaces and promotes superior solder wetting for perfect joint quality. With a heated area of 314 \\u00d7 314 mm and 95 mm clearance, the SRO-716 is compatible with a wide range of electronic components and packages. Optional features such as high vacuum, overpressure, top heating, flux management for solder paste and H2\\\/N2H2 compatibility provide maximum flexibility for various applications.<\\\/span><\\\/p>\\n\n\n<header>\\n\n\n<h5>Technical Highlights <span class=\\\"overline\\\">SRO-716<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Direct IR heating<\\\/li>\\n\n\n<li>Multiple TC monitoring<\\\/li>\\n\n\n<li>Solder paste or preform, flux-less or flux<\\\/li>\\n\n\n<li>Exchangeable heater plate<\\\/li>\\n\n\n<li>Process temperature up to 450 \\u00b0C, optional up to 750 \\u00b0C<\\\/li>\\n\n\n<li>Oxygen &lt;3.0 ppm with purified N2<\\\/li>\\n<\\\/ul>\\n\n\n<header>\\n\n\n<h5>Common Applications <span class=\\\"overline\\\">SRO-716<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Power semiconductor (IGIBT, SiC-MOSFET)<\\\/li>\\n\n\n<li>Sensors<\\\/li>\\n\n\n<li>MEMS devices<\\\/li>\\n\n\n<li>Die Attachment<\\\/li>\\n\n\n<li>High-power LED<\\\/li>\\n\n\n<li>Hybrid assembly<\\\/li>\\n\n\n<li>Flip Chip<\\\/li>\\n\n\n<li>Package sealing<\\\/li>\\n<\\\/ul>\\n<\\\/div>\\n<\\\/div>\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2026\\\/05\\\/SRO716.jpg\",\"link\":\"\"}},{\"type\":\"switcher_item\",\"props\":{\"title\":\"SRO i - LINE\",\"content\":\"\n\n<p><span>The SRO i-LINE sets new standards in series production and combines maximum efficiency with excellent process control. Thanks to its compact design and the option of integrating up to three process chambers, the SRO i-LINE maximizes production capacity without requiring additional space. Short cycle times and advanced vacuum soldering technology ensure perfect results for applications in the microelectronics and semiconductor industries. The powerful IR heating technology ensures excellent temperature homogeneity across the entire work surface, while the integrated formic acid system guarantees optimum wetting and ensures pore-free solder joints. By evacuating to &lt;1 mbar and filling the process chamber with ultra-pure N2 gas, an oxygen content of less than 3 ppm can be achieved. The SRO i-LINE enables both heating via heating plates and direct component heating. This allows even complex component geometries, such as products with integrated cooling channels, to be processed reliably. Maintenance has also been optimized to avoid production downtime: while one chamber is being serviced, production continues on two chambers. Whether used independently or as a fully integrated solution in an automated production line with high throughput, low scrap rates, and maximum process reliability, the SRO i-LINE offers a real advantage.<\\\/span><\\\/p>\\n\n\n<header>\\n\n\n<h5>Technical Highlights <span class=\\\"overline\\\">SRO i-LINE<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>HHigh capacity: up to 3 process chambers<\\\/li>\\n\n\n<li>Short cycle times<\\\/li>\\n\n\n<li>Advanced IR technology<\\\/li>\\n\n\n<li>Excellent temperature uniformity<\\\/li>\\n\n\n<li>Process temperature up to 450 \\u00b0C<\\\/li>\\n\n\n<li>Oxygen &lt;3.0 ppm with purified N2<\\\/li>\\n\n\n<li>Small footprint: no change in footprint for up to 3 process chambers<\\\/li>\\n\n\n<li>Low maintenance downtime: two process chambers can operate while one is being serviced, minimizing downtime and ensuring\\u00a0continuous production<\\\/li>\\n<\\\/ul>\\n\n\n<header>\\n\n\n<h5>Common Applications <span class=\\\"overline\\\">SRO i-LINE<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Power semiconductors (IGIBT, SiC-MOSFET)<\\\/li>\\n\n\n<li>Sensors<\\\/li>\\n\n\n<li>MEMS devices<\\\/li>\\n\n\n<li>Die Attachment<\\\/li>\\n\n\n<li>High-power LED<\\\/li>\\n\n\n<li>Hybrid assembly<\\\/li>\\n\n\n<li>Flip Chip<\\\/li>\\n\n\n<li>Package sealing<\\\/li>\\n<\\\/ul>\\n<\\\/div>\\n<\\\/div>\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2026\\\/05\\\/iline.jpg\",\"link\":\"\"}},{\"type\":\"switcher_item\",\"props\":{\"title\":\"PEO - 604\",\"content\":\"\n\n<p><span>High-temperature furnace for annealing, oxidation, polyimide application. The PEO-604 quartz tube furnace offers outstanding performance and versatility for demanding thermal applications. It is perfectly suited for research, pilot production and high volume production. Processes up to 50 wafers per run with a maximum wafer diameter of 200 mm are feasible. The high temperature furnace guarantees contamination free processing thanks to the easily exchangeable quartz liners, which prevent process to process cross-contamination.<\\\/span><\\\/p>\\n\n\n<header>\\n\n\n<h5>Technical Highlights <span class=\\\"overline\\\">PEO-604<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Space-saving thanks to small footprint<\\\/li>\\n\n\n<li>Max. 50 wafers per process run<\\\/li>\\n\n\n<li>Wafers up to \\u00d8 200 mm<\\\/li>\\n\n\n<li>No cross-contamination between different processes thanks to easily replaceable liners<\\\/li>\\n\n\n<li>20 \\u00b0C to 1,000 \\u00b0C within 25 minutes (empty chamber)<\\\/li>\\n\n\n<li>Cooling from 1,000 \\u00b0C to &lt;100 \\u00b0C within 60 minutes (empty chamber)<\\\/li>\\n\n\n<li>High vacuum up to 5 x 10-6 mbar<\\\/li>\\n\n\n<li>Oxygen &lt;3.0 ppm with ultra-pure gas N<sub>2<\\\/sub><\\\/li>\\n<\\\/ul>\\n\n\n<header>\\n\n\n<h5>Common Applications <span class=\\\"overline\\\">PEO-604<\\\/span><\\\/h5>\\n<\\\/header>\\n\n\n<div class=\\\"product-description ce-textpic\\\">\\n\n\n<ul>\\n\n\n<li>Annealing:\\n\n\n<ul>\\n\n\n<li>Inert\\\/Atmosphere<\\\/li>\\n\n\n<li>Hydrogen<\\\/li>\\n\n\n<li>High vacuum<\\\/li>\\n<\\\/ul>\\n<\\\/li>\\n\n\n<li>Wet\\\/Dry oxidation<\\\/li>\\n\n\n<li>SiAl\\\/SiAu\\\/SiMo alloying<\\\/li>\\n\n\n<li>Polyimide process<\\\/li>\\n<\\\/ul>\\n<\\\/div>\\n<\\\/div>\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2026\\\/05\\\/PEO604.jpg\",\"link\":\"\"}}],\"name\":\"Product Range (Multi Tabs)\"}]}]}],\"name\":\"Product Range\"}],\"version\":\"2.7.17\"} --><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Ersa SEMICONCompetence in Microelectronics &amp; Semiconductor Technology SRO &#8211; 700 The SRO-700 vacuum soldering system is for semiconductor and MEMS applications, offering 97 mm clearance over the heated surface. It can be used for vacuum soldering processes for low volume production or R&amp;D. The cold wall chamber principle supports effective thermal management, while the IR [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":24,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6123","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/pages\/6123","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/longshinegroup.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=6123"}],"version-history":[{"count":10,"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/pages\/6123\/revisions"}],"predecessor-version":[{"id":6184,"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/pages\/6123\/revisions\/6184"}],"up":[{"embeddable":true,"href":"https:\/\/longshinegroup.com\/index.php?rest_route=\/wp\/v2\/pages\/24"}],"wp:attachment":[{"href":"https:\/\/longshinegroup.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=6123"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}