{"id":4115,"date":"2022-03-04T02:11:36","date_gmt":"2022-03-04T02:11:36","guid":{"rendered":"http:\/\/longshinegroup.com\/?p=4115"},"modified":"2022-03-04T02:30:43","modified_gmt":"2022-03-04T02:30:43","slug":"loctite-board-level-endcapsulants","status":"publish","type":"post","link":"http:\/\/longshinegroup.com\/?p=4115","title":{"rendered":"Loctite Board Level Endcapsulants"},"content":{"rendered":"<ul>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2022\/02\/board-level-encapsulant.jpg\" alt=\"\"><\/p>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2022\/03\/packshot-grp-loctite-eccobond-fp4323-68753-01-2019-1.png\" alt=\"\"><\/p>\n<\/li>\n<\/ul>\n<h1><b>Board-Level Encapsulants<\/b><\/h1>\n<div><span>Dam and fill encapsulants and glob top materials provide effective chip protection while lowering manufacturing costs<\/span><\/div>\n<div>\n<p><span>Board-level encapsulation is an essential process for effectively protecting circuit board chips across\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics\/consumer-electronics.html\">electronic device<\/a><span>\u00a0applications. PCB encapsulation for wire bonded chips on the circuit board help protect sensitive connections from various stresses, corrosion, and moisture. Board-level encapsulants offer excellent temperature stability, good thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage during cure, low stress, and excellent chemical resistance.<\/span><\/p>\n<div class=\"text\">\n<div class=\"container \">\n<div class=\"text__base\" data-components=\"Text\" data-ga-attributes=\"{&quot;navigation-type&quot;: &quot;Link&quot;}\">\n<h2><strong>Dam and Fill Encapsulation<\/strong><\/h2>\n<p>Henkel\u2019s dam and fill solutions provide a number of product and application method options for manufactures. There are three parts of encapsulation compound systems which includes a polymer, hardener, and filler. For PCB encapsulation, a number of different dispensing processes can be used based on the manufacturer\u2019s equipment. This includes time\/pressure, auger, and positive displacement dispensing methods.\u00a0<\/p>\n<p>The dam and fill encapsulation method has been utilized across a number of manufacturing processes. A dam is a thin border that is dispensed around the application area according to a preset size specification. The fill then is dispensed within the confines of the dam area in which it encapsulants and protects the die wires underneath. There are different encapsulant chemistries to choose from based on your specific needs. For this reason, the ECCOBOND<sup>\u00ae<\/sup><span>\u00a0<\/span>line offers a number of materials for both the dam and fill processes. From heat curing and UV cure encapsulant options to epoxy and acrylic chemistries, our product portfolio has a variety of product solutions for board-level encapsulation.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"text\">\n<div class=\"container \">\n<div class=\"text__base\" data-components=\"Text\" data-ga-attributes=\"{&quot;navigation-type&quot;: &quot;Link&quot;}\">\n<h2>Glob Topping<\/h2>\n<p>Glob top materials that excellent temperature stability, good thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage during cure, low stress, and excellent chemical resistance. They are developed to provide protection to wire bonds and leads across a comprehensive range of<span>\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/products\/encapsulants.html\">electronic<\/a><span>\u00a0<\/span>applications, bringing superior reliability, stability, and electrical insulation in high stress environments and across a range of temperatures. The absence of a dam reduces cost and increases efficiency for operations that utilize glob topping.<\/p>\n<p>Henkel\u2019s line of LOCTITE<sup>\u00ae<\/sup>\u00a0ECCOBOND<sup>\u00ae<\/sup>\u00a0glob top encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. Our glob top materials are designed to meet the demanding requirements of manufacturers in many industries\u2014ensuring easy application, strong bonding, and fast curing times for a variety of\u00a0<a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics.html\">electrical<\/a>\u00a0components. Henkel has designed its glob top epoxies, adhesives, and other materials to fit seamlessly within your existing cycles, offering ultimate versatility in a comprehensive range of industrial processes.\u00a0<\/p>\n<p>Henkel high-purity glob top encapsulants deliver unmatched performance for a variety of products including transistors, system in package (SIP) devices, ASICs, and chip-on-board applications. Cycle time and costs can be reduced through the use of LOCTITE<sup>\u00ae<\/sup>\u00a0ECCOBOND<sup>\u00ae<\/sup>\u00a0glob top materials, bringing increased efficiency to a range of processes. These materials for chip-on-board applications are designed to cure quickly to fit easily within high-speed manufacturing operations.\u00a0<\/p>\n<p>Like all Henkel materials, ECCOBOND<sup>\u00ae<\/sup>\u00a0glob top encapsulants are formulated and tested in-process and in the context of full-package assembly. They meet the most stringent JEDEC-level testing requirements and are developed to deliver outstanding performance within high temperature, lead-free environments. Partner with Henkel and discover the very best chip-on-board materials designed for the next generation of\u00a0<a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics\/consumer-electronics.html\">electrical devices<\/a>.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"text\">\n<div class=\"container \">\n<div class=\"text__base\" data-components=\"Text\" data-ga-attributes=\"{&quot;navigation-type&quot;: &quot;Link&quot;}\">\n<h3>Glob Top Chemistries<\/h3>\n<p>Each of the glob top materials in our ECCOBOND<sup>\u00ae<\/sup><span>\u00a0<\/span>range is also designed to meet strict environmental compliance, allowing manufacturers to reduce harsh chemicals during manufacturing processes and increase sustainability. Available as<strong><span>\u00a0<\/span><\/strong>thermal, ultraviolet (UV), or moisture cure materials, Henkel has developed a suitable glob top encapsulant for your specific requirements. Additionally, halogen-free encapsulants ensure safer processing during assembly.<\/p>\n<p><strong>The ECCOBOND<sup>\u00ae<\/sup><span>\u00a0<\/span>range glob top encapsulant chemistries:<\/strong><\/p>\n<ul>\n<li>Epoxy<\/li>\n<li>Silicone<\/li>\n<li>Acrylates<\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<hr>\n<ul>\n<li>\n<h3>Introduction<\/h3>\n<div>\n<p><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics.html\">Electronics<\/a><span>\u00a0manufacturers are in need of high-quality materials that are highly suited for their specific needs. Our glob top materials are a trusted\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/products\/encapsulants.html\">encapsulation<\/a><span>\u00a0material that help reduce costs and enable manufacturing efficiency and are used by many manufactures around the world. We offer a number of different solutions for electronics manufacturing which include semiconductors\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics\/semiconductor-packaging\/advanced-semiconductor-packaging.html\">flip chip solutions<\/a><span>,\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics\/semiconductor-packaging\/advanced-semiconductor-packaging.html\">semiconductor packaging materials<\/a><span>, and\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/industries\/electronics\/semiconductor-packaging\/component-level-electromagnetic-shielding.html\">EMI shielding solutions<\/a><span>. Henkel also supplies a range of other encapsulant materials such as\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/products\/industrial-coatings\/conformal-coatings.html\">conformal coatings,<\/a><span>\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/products\/encapsulants\/underfills.html\">underfills<\/a><span>,\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/products\/encapsulants\/potting-compounds.html\">potting compounds<\/a><span>, and\u00a0<\/span><a href=\"https:\/\/www.henkel-adhesives.com\/my\/en\/products\/encapsulants\/low-pressure-molding.html\">low pressure molding<\/a><span>\u00a0materials.\u00a0<\/span><\/p>\n<\/div>\n<\/li>\n<li>\n<h3>Technical Data<\/h3>\n<div>\n<p><a href=\"http:\/\/longshinegroup.com\/wp-content\/uploads\/2022\/03\/logo-1.pdf\"><img loading=\"lazy\" decoding=\"async\" src=\"http:\/\/longshinegroup.com\/wp-content\/uploads\/2022\/02\/pdf-244x300.png\" alt=\"\" width=\"75\" height=\"92\" class=\"alignnone  wp-image-2562\" srcset=\"http:\/\/longshinegroup.com\/wp-content\/uploads\/2022\/02\/pdf-244x300.png 244w, http:\/\/longshinegroup.com\/wp-content\/uploads\/2022\/02\/pdf-768x943.png 768w, http:\/\/longshinegroup.com\/wp-content\/uploads\/2022\/02\/pdf.png 833w\" sizes=\"auto, (max-width: 75px) 100vw, 75px\" \/><\/a><\/p>\n<\/div>\n<\/li>\n<\/ul>\n<h2>Related Products<\/h2>\n<ul>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2022\/02\/Product-versa-one.webp\" alt=\"\"><\/p>\n<h3>Versaflow One<\/h3>\n<p>Ersa<\/p>\n<p><a href=\"#\"><\/a><\/p>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2022\/02\/Product-versaflow4-xl.webp\" alt=\"\"><\/p>\n<h3>Versaflow 4 XL<\/h3>\n<p>Ersa<\/p>\n<p><a href=\"#\"><\/a><\/p>\n<\/li>\n<li>\n<p>        <img decoding=\"async\" src=\"\/wp-content\/uploads\/2022\/02\/Product-versaflow-3-35-ultra-global-edition.webp\" alt=\"\"><\/p>\n<h3>Versaflow 3\/35 Global Edition<\/h3>\n<p>Ersa<\/p>\n<p><a href=\"#\"><\/a><\/p>\n<\/li>\n<\/ul>\n<p><!--more--><br \/>\n<!-- {\"name\":\"* LAYOUT | Product Detail Page - New Product Layout (v1)\",\"type\":\"layout\",\"children\":[{\"type\":\"section\",\"props\":{\"style\":\"muted\",\"width\":\"default\",\"vertical_align\":\"middle\",\"title_position\":\"top-left\",\"title_rotation\":\"left\",\"title_breakpoint\":\"xl\",\"image_position\":\"center-center\",\"image\":\"\"},\"children\":[{\"type\":\"row\",\"props\":{\"layout\":\"1-2,1-2\",\"margin\":\"default\",\"row_gap\":\"large\"},\"children\":[{\"type\":\"column\",\"props\":{\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\",\"width_medium\":\"1-2\",\"position_sticky_breakpoint\":\"m\"},\"children\":[{\"type\":\"slideshow\",\"props\":{\"show_title\":false,\"show_meta\":true,\"show_content\":true,\"show_link\":true,\"show_thumbnail\":true,\"slideshow_min_height\":\"300\",\"slideshow_autoplay_pause\":true,\"nav\":\"thumbnav\",\"nav_position\":\"bottom-center\",\"nav_position_margin\":\"medium\",\"nav_align\":\"left\",\"nav_breakpoint\":\"\",\"thumbnav_width\":\"80\",\"thumbnav_height\":\"45\",\"thumbnav_svg_color\":\"emphasis\",\"slidenav\":\"\",\"slidenav_margin\":\"medium\",\"slidenav_breakpoint\":\"s\",\"slidenav_outside_breakpoint\":\"xl\",\"overlay_position\":\"center-left\",\"overlay_animation\":\"fade\",\"title_element\":\"h3\",\"meta_style\":\"meta\",\"meta_align\":\"below-title\",\"link_text\":\"Read more\",\"link_style\":\"default\",\"margin\":\"remove-vertical\",\"slideshow_height\":\"\",\"slideshow_box_shadow\":\"\",\"slideshow_box_decoration\":\"\",\"slideshow_animation\":\"fade\",\"slideshow_kenburns\":\"\",\"nav_margin\":\"small\",\"nav_color\":\"\",\"slidenav_outside_color\":\"\",\"overlay_container\":\"\",\"overlay_container_padding\":\"\",\"overlay_width\":\"\",\"container_padding_remove\":true,\"image_width\":\"1600\",\"slideshow_ratio\":\"\",\"thumbnav_nowrap\":true,\"meta_element\":\"div\",\"image_height\":\"900\",\"slideshow_max_height\":\"\",\"nav_below\":true,\"css\":\".uk-margin-small-top {\\n    margin-top: 15px!important;}\"},\"children\":[{\"type\":\"slideshow_item\",\"props\":{\"title\":\"\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2022\\\/02\\\/board-level-encapsulant.jpg\",\"image_alt\":\"\"}},{\"type\":\"slideshow_item\",\"props\":{\"title\":\"\",\"thumbnail\":\"\",\"image\":\"wp-content\\\/uploads\\\/2022\\\/03\\\/packshot-grp-loctite-eccobond-fp4323-68753-01-2019-1.png\",\"image_alt\":\"\"}}],\"name\":\"Images (Slideshow)\"}]},{\"type\":\"column\",\"props\":{\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\",\"width_medium\":\"1-2\",\"position_sticky_breakpoint\":\"m\",\"image\":\"\"},\"children\":[{\"type\":\"headline\",\"props\":{\"title_element\":\"div\",\"title_style\":\"h6\",\"title_color\":\"muted\",\"text_align\":\"left\",\"margin\":\"remove-vertical\",\"block_align\":\"center\",\"block_align_breakpoint\":\"m\",\"content\":\"\",\"link\":\"\"},\"name\":\"Product Category\"},{\"type\":\"headline\",\"props\":{\"title_element\":\"h1\",\"title_style\":\"h2\",\"text_align\":\"left\",\"margin\":\"default\",\"margin_remove_top\":false,\"block_align\":\"center\",\"block_align_breakpoint\":\"m\",\"content\":\"<b>Board-Level Encapsulants<\\\/b>\"},\"name\":\"Product Name\"},{\"type\":\"headline\",\"props\":{\"title_element\":\"div\",\"title_style\":\"h5\",\"text_align\":\"left\",\"margin\":\"remove-vertical\",\"margin_remove_top\":false,\"block_align\":\"center\",\"block_align_breakpoint\":\"m\",\"class\":\"\",\"content\":\"<span>Dam and fill encapsulants and glob top materials provide effective chip protection while lowering manufacturing costs<\\\/span>\"},\"name\":\"Unique Selling Point\"},{\"type\":\"text\",\"props\":{\"margin\":\"default\",\"column_breakpoint\":\"m\",\"content\":\"\n\n<p><span>Board-level encapsulation is an essential process for effectively protecting circuit board chips across\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics\\\/consumer-electronics.html\\\">electronic device<\\\/a><span>\\u00a0applications. PCB encapsulation for wire bonded chips on the circuit board help protect sensitive connections from various stresses, corrosion, and moisture. Board-level encapsulants offer excellent temperature stability, good thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage during cure, low stress, and excellent chemical resistance.<\\\/span><\\\/p>\\n\n\n<div class=\\\"text\\\">\\n\n\n<div class=\\\"container \\\">\\n\n\n<div class=\\\"text__base\\\" data-components=\\\"Text\\\" data-ga-attributes=\\\"{&quot;navigation-type&quot;: &quot;Link&quot;}\\\">\\n\n\n<h2><strong>Dam and Fill Encapsulation<\\\/strong><\\\/h2>\\n\n\n<p>Henkel\\u2019s dam and fill solutions provide a number of product and application method options for manufactures. There are three parts of encapsulation compound systems which includes a polymer, hardener, and filler. For PCB encapsulation, a number of different dispensing processes can be used based on the manufacturer\\u2019s equipment. This includes time\\\/pressure, auger, and positive displacement dispensing methods.\\u00a0<\\\/p>\\n\n\n<p>The dam and fill encapsulation method has been utilized across a number of manufacturing processes. A dam is a thin border that is dispensed around the application area according to a preset size specification. The fill then is dispensed within the confines of the dam area in which it encapsulants and protects the die wires underneath. There are different encapsulant chemistries to choose from based on your specific needs. For this reason, the ECCOBOND<sup>\\u00ae<\\\/sup><span>\\u00a0<\\\/span>line offers a number of materials for both the dam and fill processes. From heat curing and UV cure encapsulant options to epoxy and acrylic chemistries, our product portfolio has a variety of product solutions for board-level encapsulation.<\\\/p>\\n<\\\/div>\\n<\\\/div>\\n<\\\/div>\\n\n\n<div class=\\\"text\\\">\\n\n\n<div class=\\\"container \\\">\\n\n\n<div class=\\\"text__base\\\" data-components=\\\"Text\\\" data-ga-attributes=\\\"{&quot;navigation-type&quot;: &quot;Link&quot;}\\\">\\n\n\n<h2>Glob Topping<\\\/h2>\\n\n\n<p>Glob top materials that excellent temperature stability, good thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage during cure, low stress, and excellent chemical resistance. They are developed to provide protection to wire bonds and leads across a comprehensive range of<span>\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/products\\\/encapsulants.html\\\">electronic<\\\/a><span>\\u00a0<\\\/span>applications, bringing superior reliability, stability, and electrical insulation in high stress environments and across a range of temperatures. The absence of a dam reduces cost and increases efficiency for operations that utilize glob topping.<\\\/p>\\n\n\n<p>Henkel\\u2019s line of LOCTITE<sup>\\u00ae<\\\/sup>\\u00a0ECCOBOND<sup>\\u00ae<\\\/sup>\\u00a0glob top encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. Our glob top materials are designed to meet the demanding requirements of manufacturers in many industries\\u2014ensuring easy application, strong bonding, and fast curing times for a variety of\\u00a0<a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics.html\\\">electrical<\\\/a>\\u00a0components. Henkel has designed its glob top epoxies, adhesives, and other materials to fit seamlessly within your existing cycles, offering ultimate versatility in a comprehensive range of industrial processes.\\u00a0<\\\/p>\\n\n\n<p>Henkel high-purity glob top encapsulants deliver unmatched performance for a variety of products including transistors, system in package (SIP) devices, ASICs, and chip-on-board applications. Cycle time and costs can be reduced through the use of LOCTITE<sup>\\u00ae<\\\/sup>\\u00a0ECCOBOND<sup>\\u00ae<\\\/sup>\\u00a0glob top materials, bringing increased efficiency to a range of processes. These materials for chip-on-board applications are designed to cure quickly to fit easily within high-speed manufacturing operations.\\u00a0<\\\/p>\\n\n\n<p>Like all Henkel materials, ECCOBOND<sup>\\u00ae<\\\/sup>\\u00a0glob top encapsulants are formulated and tested in-process and in the context of full-package assembly. They meet the most stringent JEDEC-level testing requirements and are developed to deliver outstanding performance within high temperature, lead-free environments. Partner with Henkel and discover the very best chip-on-board materials designed for the next generation of\\u00a0<a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics\\\/consumer-electronics.html\\\">electrical devices<\\\/a>.<\\\/p>\\n<\\\/div>\\n<\\\/div>\\n<\\\/div>\\n\n\n<div class=\\\"text\\\">\\n\n\n<div class=\\\"container \\\">\\n\n\n<div class=\\\"text__base\\\" data-components=\\\"Text\\\" data-ga-attributes=\\\"{&quot;navigation-type&quot;: &quot;Link&quot;}\\\">\\n\n\n<h3>Glob Top Chemistries<\\\/h3>\\n\n\n<p>Each of the glob top materials in our ECCOBOND<sup>\\u00ae<\\\/sup><span>\\u00a0<\\\/span>range is also designed to meet strict environmental compliance, allowing manufacturers to reduce harsh chemicals during manufacturing processes and increase sustainability. Available as<strong><span>\\u00a0<\\\/span><\\\/strong>thermal, ultraviolet (UV), or moisture cure materials, Henkel has developed a suitable glob top encapsulant for your specific requirements. Additionally, halogen-free encapsulants ensure safer processing during assembly.<\\\/p>\\n\n\n<p><strong>The ECCOBOND<sup>\\u00ae<\\\/sup><span>\\u00a0<\\\/span>range glob top encapsulant chemistries:<\\\/strong><\\\/p>\\n\n\n<ul>\\n\n\n<li>Epoxy<\\\/li>\\n\n\n<li>Silicone<\\\/li>\\n\n\n<li>Acrylates<\\\/li>\\n<\\\/ul>\\n<\\\/div>\\n<\\\/div>\\n<\\\/div>\",\"block_align_breakpoint\":\"m\",\"block_align\":\"center\",\"text_align\":\"left\"},\"name\":\"Product Description\"}]}]},{\"type\":\"row\",\"children\":[{\"type\":\"column\",\"props\":{\"position_sticky_breakpoint\":\"m\",\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\"},\"children\":[{\"type\":\"divider\",\"props\":{\"divider_element\":\"hr\"}}]}]},{\"type\":\"row\",\"props\":{\"margin\":\"default\"},\"children\":[{\"type\":\"column\",\"props\":{\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\",\"position_sticky_breakpoint\":\"m\",\"width_medium\":\"\"},\"children\":[{\"type\":\"switcher\",\"props\":{\"show_title\":false,\"show_meta\":true,\"show_content\":true,\"show_image\":true,\"show_link\":true,\"show_label\":true,\"show_thumbnail\":true,\"switcher_animation\":\"fade\",\"switcher_height\":false,\"title_element\":\"h3\",\"title_align\":\"top\",\"title_grid_width\":\"1-2\",\"meta_style\":\"meta\",\"meta_align\":\"below-title\",\"image_svg_color\":\"\",\"image_align\":\"bottom\",\"image_grid_width\":\"1-2\",\"link_text\":\"Read more\",\"link_style\":\"default\",\"margin\":\"large\",\"image_svg_inline\":true,\"title_grid_breakpoint\":\"m\",\"image_grid_breakpoint\":\"m\",\"meta_element\":\"div\",\"content_column_breakpoint\":\"m\",\"margin_remove_bottom\":false,\"margin_remove_top\":false,\"nav\":\"tab\",\"thumbnav_width\":\"100\",\"thumbnav_height\":\"75\",\"thumbnav_svg_color\":\"emphasis\",\"nav_position\":\"top\",\"nav_align\":\"left\",\"nav_margin\":\"\",\"nav_grid_width\":\"1-3\",\"nav_grid_column_gap\":\"large\",\"nav_grid_row_gap\":\"large\",\"nav_grid_breakpoint\":\"m\"},\"children\":[{\"type\":\"switcher_item\",\"props\":{\"image\":\"\",\"title\":\"Introduction\",\"content\":\"\n\n<p><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics.html\\\">Electronics<\\\/a><span>\\u00a0manufacturers are in need of high-quality materials that are highly suited for their specific needs. Our glob top materials are a trusted\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/products\\\/encapsulants.html\\\">encapsulation<\\\/a><span>\\u00a0material that help reduce costs and enable manufacturing efficiency and are used by many manufactures around the world. We offer a number of different solutions for electronics manufacturing which include semiconductors\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics\\\/semiconductor-packaging\\\/advanced-semiconductor-packaging.html\\\">flip chip solutions<\\\/a><span>,\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics\\\/semiconductor-packaging\\\/advanced-semiconductor-packaging.html\\\">semiconductor packaging materials<\\\/a><span>, and\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/industries\\\/electronics\\\/semiconductor-packaging\\\/component-level-electromagnetic-shielding.html\\\">EMI shielding solutions<\\\/a><span>. Henkel also supplies a range of other encapsulant materials such as\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/products\\\/industrial-coatings\\\/conformal-coatings.html\\\">conformal coatings,<\\\/a><span>\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/products\\\/encapsulants\\\/underfills.html\\\">underfills<\\\/a><span>,\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/products\\\/encapsulants\\\/potting-compounds.html\\\">potting compounds<\\\/a><span>, and\\u00a0<\\\/span><a href=\\\"https:\\\/\\\/www.henkel-adhesives.com\\\/my\\\/en\\\/products\\\/encapsulants\\\/low-pressure-molding.html\\\">low pressure molding<\\\/a><span>\\u00a0materials.\\u00a0<\\\/span><\\\/p>\"}},{\"type\":\"switcher_item\",\"props\":{\"image\":\"\",\"title\":\"Technical Data\",\"content\":\"\n\n<p><a href=\\\"http:\\\/\\\/longshinegroup.com\\\/wp-content\\\/uploads\\\/2022\\\/03\\\/logo-1.pdf\\\"><img src=\\\"http:\\\/\\\/longshinegroup.com\\\/wp-content\\\/uploads\\\/2022\\\/02\\\/pdf-244x300.png\\\" alt=\\\"\\\" width=\\\"75\\\" height=\\\"92\\\" class=\\\"alignnone  wp-image-2562\\\" \\\/><\\\/a><\\\/p>\"}}],\"name\":\"Product Details (Multi Tabs)\"}]}]}],\"name\":\"Product Details\"},{\"type\":\"section\",\"props\":{\"style\":\"default\",\"width\":\"default\",\"vertical_align\":\"middle\",\"title_position\":\"top-left\",\"title_rotation\":\"left\",\"title_breakpoint\":\"xl\",\"image_position\":\"center-center\",\"image\":\"\"},\"children\":[{\"type\":\"row\",\"children\":[{\"type\":\"column\",\"props\":{\"image_position\":\"center-center\",\"media_overlay_gradient\":\"\",\"width_medium\":\"1-1\",\"position_sticky_breakpoint\":\"m\"},\"children\":[{\"type\":\"headline\",\"props\":{\"title_element\":\"h2\",\"title_style\":\"h3\",\"text_align\":\"center\",\"margin\":\"large\",\"content\":\"Related Products\"},\"name\":\"Title\"},{\"type\":\"grid\",\"props\":{\"show_title\":true,\"show_meta\":true,\"show_content\":true,\"show_image\":true,\"show_link\":true,\"grid_default\":\"1\",\"grid_medium\":\"3\",\"filter_style\":\"tab\",\"filter_all\":true,\"filter_position\":\"top\",\"filter_align\":\"left\",\"filter_grid_width\":\"auto\",\"title_element\":\"h3\",\"title_align\":\"top\",\"title_grid_width\":\"1-2\",\"meta_style\":\"meta\",\"meta_align\":\"below-title\",\"image_align\":\"top\",\"image_grid_width\":\"1-2\",\"image_svg_color\":\"emphasis\",\"link_text\":\"\",\"link_style\":\"default\",\"margin\":\"\",\"item_animation\":true,\"grid_small\":\"2\",\"title_style\":\"h6\",\"meta_margin\":\"small\",\"text_align\":\"center\",\"title_hover_style\":\"heading\",\"image_width\":\"610\",\"filter_grid_breakpoint\":\"m\",\"title_grid_breakpoint\":\"m\",\"image_grid_breakpoint\":\"m\",\"panel_link\":false,\"icon_width\":80,\"meta_element\":\"div\",\"content_column_breakpoint\":\"m\",\"title_link\":true,\"image_link\":true,\"panel_padding\":\"\",\"panel_card_size\":\"\"},\"children\":[{\"type\":\"grid_item\",\"props\":{\"tags\":\"\",\"title\":\"Versaflow One\",\"meta\":\"Ersa\",\"image\":\"wp-content\\\/uploads\\\/2022\\\/02\\\/Product-versa-one.webp\",\"image_alt\":\"\",\"link\":\"#\"}},{\"type\":\"grid_item\",\"props\":{\"tags\":\"\",\"title\":\"Versaflow 4 XL\",\"meta\":\"Ersa\",\"image\":\"wp-content\\\/uploads\\\/2022\\\/02\\\/Product-versaflow4-xl.webp\",\"image_alt\":\"\",\"link\":\"#\"}},{\"type\":\"grid_item\",\"props\":{\"tags\":\"\",\"title\":\"Versaflow 3\\\/35 Global Edition\",\"meta\":\"Ersa\",\"image\":\"wp-content\\\/uploads\\\/2022\\\/02\\\/Product-versaflow-3-35-ultra-global-edition.webp\",\"image_alt\":\"\",\"link\":\"#\"}}],\"name\":\"Related Products\"}]}]}],\"modified\":\"2022-01-27T08:47:09.879Z\",\"name\":\"Related product\"}],\"version\":\"2.7.17\"} --><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Board-Level Encapsulants Dam and fill encapsulants and glob top materials provide effective chip protection while lowering manufacturing costs Board-level encapsulation is an essential process for effectively protecting circuit board chips across\u00a0electronic device\u00a0applications. PCB encapsulation for wire bonded chips on the circuit board help protect sensitive connections from various stresses, corrosion, and moisture. 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