Optical Inspection Systems

Ersa Mobile Scope

Hand-held system for quick inspection of hidden solder joints

Compact, portable video microscope for examining solder joints in electronics manufacturing. It is designed for optical inspection and digital imaging as well as measurement tasks at solder joints of ball grid array (BGA), μBGA, CSP and flip chip components.

- Mobile inspection system with two quick change lenses (depending on equipment):
  – 90° BGA optics (approx. 280 µm clearance)
  – 0° MACROZOOM top view optics
- Fast, hand-operated inspection of hidden solder joints
- Integrated, dimmable LED lighting
- 2 Megapixel N-MOS colour camera with USB connection
- Including additional LED fibre light for BGA optics
- Ideal for inspection of continuously changing locations and for service
- Including Ersa ImageDoc v3 inspection software (basic version)