The demands of electronics production for pore-free soldered connections – especially for power electronics and high-reliability technology – are answered by Ersa with the EXOS 10/26, a convection reflow soldering system with 22 heating chambers and 4 cooling zones as well as a vacuum chamber after the peak zone, with which the void rate can be reduced by an impressive 99%. Thanks to intelligent features, the EXOS 10/26 can produce particularly economically and “void-free”.
How to avoid Voids? Ersa EXOS 10/26!
A challenge for SMD solder joints is voids reducing the solder joint quality. They may even lead to component failure. The void rate can be reduced by applying a vacuum as soon as the solder becomes liquid. By striving for pressure compensation, the voids migrate into the area of the negative pressure, thus leaving the solder joints.