Reflow Soldering Systems

EXOS 10/26

The demands of electronics production for pore-free soldered connections – especially for power electronics and high-reliability technology – are answered by Ersa with the EXOS 10/26, a convection reflow soldering system with 22 heating chambers and 4 cooling zones as well as a vacuum chamber after the peak zone, with which the void rate can be reduced by an impressive 99%. Thanks to intelligent features, the EXOS 10/26 can produce particularly economically and “void-free”.

How to avoid Voids? Ersa EXOS 10/26!

A challenge for SMD solder joints is voids reducing the solder joint quality. They may even lead to component failure. The void rate can be reduced by applying a vacuum as soon as the solder becomes liquid. By striving for pressure compensation, the voids migrate into the area of the negative pressure, thus leaving the solder joints.

- 4-part conveyor (infeed, preheating and peak, vacuum, cooling zone) also as dual track
- Perfect synchronization of the assemblies and transitions thanks to sensor-monitored conveyor, no external infeed module required
- Maintenance-friendly and lubricant-free roller conveyor in the vacuum module
- Optimum access to the vacuum chamber through lifting unit from above
- Optimum temperature profiles through medium-wave emitters in the vacuum module
- Maximum machine availability thanks to fast removal of the conveyor unit in the vacuum module
- Part-integrated vacuum pump on separate module carrier for easy and fast maintenance
- Innovative cleaning system SMART ELEMENTS